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TSD BN Product - CPU Heat Sink Thermal Test


Heat Sink with TSD Coating thermal test

November 21, 2006


Tested by Nelson Ma



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TSD BN thermal coating improves thermal management by conducting thermal transfer away from the heat source.





Reduce >10~30℃

High thermal conductivity

Increase performance and reliability by thermal management

Withstand up to (200℃~1500℃)

Increase air-to-surface cooling areas

Non-wetting surface

Good chemical inertness

Corrosion resistance

Oxidization resistance


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