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TSD BN Product - CPU Heat Sink Thermal Test

 

Heat Sink with TSD Coating thermal test

November 21, 2006

 

Tested by Nelson Ma

   

 

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Advantages

 

TSD BN thermal coating improves thermal management by conducting thermal transfer away from the heat source.

 

 

Characteristics

 

Reduce >10~30℃

High thermal conductivity

Increase performance and reliability by thermal management

Withstand up to (200℃~1500℃)

Increase air-to-surface cooling areas

Non-wetting surface

Good chemical inertness

Corrosion resistance

Oxidization resistance

 

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