| TSD - Thermal Pad    

 |Home

 
     

     
   

TSD BN Product - Thermal Pad

 

TSD BN thermal pad is another solution other than TSD BN thermal grease.

 

   

Advantage

 

The BN silicon thermal pads offer another solution to thermal interface material achieving 4.77 W/mK thermal conductivity.

 

Features and Benefits

 

  High thermal conductivity of 4.7 W/mK

  Low thermal resistance

  Thickness – Varies from 0.45mm ~ 1.5mm

 

Applications

 

  Power conversion equipment

  Power components

  Notebook computers

  CPU

  GPU

Order

Please contact TSD.

Product Information

How to purchase

Product Media