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TSD BN Product - Thermal Grease

TSD BN thermal grease offers thermal conductivity of 2.47 W/mk and suitable for CPU's, GPUs, chipsets, power components, and more.

   

The unique BN composition offers low thermal resistances and outstand reliability.  The BN thermal greases do not dry out or pump-out and remain stable.

 

 

Features and Benefits

 

  High thermal conductivity of 2.47 W/mK

  Low thermal resistance

  Low dielectric constant and loss tangent

 

 

Applications

 

          CPU's for desktop and notebook computers and servers

          GPUs

          Chipsets

          Power components

 

Specifications

       

Thermal conductivity:                    2.47 W/mK

Thermal resistance:                       Very low

Feature

 

High thermal conductivity of 2.47 W/mK
Low thermal resistance

 

 

Package

 

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