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TSD BN Product - Solid

 

TSD provides high pressure BN hot pressed solids for various applications.

   

Advantages

 

hBN hot pressed solids is used for substrates for mounting high density and high power electronic components where the high thermal conductivity achieved allows efficient heat dissipation.
 

Hot-pressed BN is compacted at temperatures up to 2000℃.  Currently TSD offers low pressure hot-pressed BN, but will soon offering height pressure hot-pressed BN.  Hot-pressed BN can result in limited thermal shock resistance.

 

Hexagonal Boron Nitride Characteristics:

 

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High thermal conductivity

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High electrical resistance

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High thermal shock resistance

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Corrosion and oxidization resistance

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Chemically inert

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Low loss tangent and low dielectric constant

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Excellent radiated heat transfer

 

 

 

Applications

 

Heat sink in transistor packages

Insulators

 

產品規格

 

 

Boron nitride

Aluminum oxide

Dielectric constant

4.2

9.7

Thermal conductivity at RT W/mK

55~70

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Package

 

Customer request

 

Product Information

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